High-power LED heatsink-based copper-clad printed circuit laminate pre-treatment process: selection of raw materials and reagents, sodium hydroxide, sulfuric acid, dimethylformamide, aluminum hydroxide, dihydroamine, acetone, aluminum profiles, Curing agent, accelerator. Aluminium heat sink substrate surface anodizing treatment The aluminum profile heat sink substrate is treated with sodium hydroxide until the oil is removed. After cleaning, it is oxidized. When oxidizing, a sulfuric acid solution is used, and the oxide film is appropriately thickened and washed for use. The insulating thermal conductive film is prepared by mixing aluminum hydroxide and epoxy resin, adding to the oven for heating, adding to the reaction kettle after cooling, adding acetone and stirring, adding an appropriate amount of curing agent, and the accelerator is completely used for the reaction. The aluminum profile heat sink substrate is coated with an organic insulating thermal conductive adhesive film to uniformly coat the prepared organic insulating thermal conductive adhesive film on the processed aluminum profile heat sink substrate, and dried in a drying tunnel to a semi-cured state. Apply an appropriate thickness of organic medium. The aluminum profile heat sink substrate laminated on the organic insulating thermal conductive adhesive film covers a copper foil of 0.035 mm, and is pressed by a vacuum press.
High-power LED heatsink-based copper-clad printed circuit laminate production process by using aluminum oxide and epoxy resin mixed into machine insulation thermal film, solving the technical problem of poor thermal conductivity of insulating medium - epoxy resin Because epoxy resin has good insulation performance and adhesive property, but thermal conductivity is poor, and aluminum oxide has both good insulation performance and good thermal conductivity, so the combination of the two not only solves the adhesive performance, but also The invention solves the problem of improving the thermal conductivity without reducing the insulation performance, and after the appropriate hot pressing treatment, the seamless connection of the heat sink and the copper foil printed circuit board is realized. The manufacturing process: firstly, the copper foil plate, the high thermal conductive insulating layer and the heat sink substrate are pressed together by high temperature and high pressure to form a heat sink plate → the heat sink substrate is dimmed → the heat sink substrate is anodized → coated Organic film → drying → molding → lamination → demoulding → shearing → filming. Finally, the heat sink base copper clad plate is processed into a heat sink base printed board, which realizes the seamless connection between the heat sink and the copper foil printed circuit board, and greatly reduces the heat dissipation resistance (thermal resistance: ≤ 0.25 ° C / W) Improves the heat dissipation effect of high-power LED devices.
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